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VoltDRAM
VoltDRAM
| Rigid PCB Manufacturing Capability | |||
|---|---|---|---|
| Category | Specification Detail | Volume Production | Sample Processing |
| Layer Count | 1-68L | 64 Layer | |
| Max Thickness | 10mm (394mil) | 14mm (551mil) | |
| Min Line Width/Space | Inner Layer | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Outer Layer | 2.5mil / 2.5mil | 2.2mil / 2.2mil | |
| Alignment Capability | Alignment with the Core Board | ±25um | ±20um |
| Inner Layer Alignment | ±5mil | ±4mil | |
| Max Copper | 6oz | 30oz | |
| Holes Size | Mechanical Drilling | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Laser Drilling | 0.1mm (4mil) | 0.050mm (2mil) | |
| Max Size | Unit Size | 850mm x 570mm | 1000mm x 600mm |
| Panel Size | 1250mm x 570mm | 1320mm x 600mm | |
| Aspect Ratio | Unit Size | 20:1 | 28:1 |
| Panel Size | 25:1 | 35:1 | |
| Material | Lead-free / Halogen-free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-speed PCB Material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | ||
| High-frequency PCB Material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | ||
| Surface Finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold / Soft Gold Plating | ||
| Special Technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB | ||
| Layer Count | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |
24h technical support
24h Gerber files handling
Complete EQ within 4-8 hours
Support for 400 new project engineering reviews
RS-274-X & RS-274-D
CAD, DXP, Protel 99 SE
PADS, GC-CAM
All processes running 24 hours
Monthly production of more than 10K high mix part numbers
More than 100 QTA orders every day
One-step service from prototype to mass production
24 hours quick response
4 hours quick response for quotation
Our capability ranges from high-density multilayer boards (up to 68 layers), impedance boards, high-frequency and 5G high-speed boards, to specialty technologies such as high TG thick copper, buried blind via, aluminum-based, hybrid dielectric, HDI, rigid-flex, and customized solutions.
Our shortest lead times for samples are 24 hours for 2-layer PCBs, 36 hours for 4-layer PCBs, and 48 hours for 6-layer PCBs. For high-layer count boards such as 10 to 16 layers, sample processing ranges between 4 to 5 days.
We accept a wide range of standard design and manufacturing files, including RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, and GC-CAM file formats.
Our products and operations strictly comply with globally recognized standards including UL, ISO 9001:2015, ISO 14001:2015, CQC, IATF 16949:2016, and the "National Military Standard."
We offer flexible logistics, shipping via Air (using UPS, DHL, TNT, CTS, and FEDEX), Railway, Seaborne, or any other method designated by our customers.
