VoltDRAM
Engineered to deliver exceptional heat transfer performance, supporting key standard sockets and demanding TDP profiles.
LGA1700 M-ATX Compact 6-Tube Copper Aluminum Red LED Heat Sink 220W Air Cooled 4Pin Interface Supports Intel CPU Computer Case
View Product Specifications
Server CPU Heat Sink with Hydraulic Bearings Copper Aluminum Fan 2U Aluminum Fin 4 Heat Pipes ARGB Support for Computer Case
View Product Specifications
95W LGA115X 1U Server Radiator Air-cooled Radiator Computer Server Radiator
View Product Specifications
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
View Product Specifications
300W LGA 4677 Desktop 2U Server Laptop CPU Heat Sink Cooler Cooling Fan with 4-pin
View Product Specifications
Igh Performance 1U Copper LGA4677 400W Water Cooler Block LGA4189 Liquid CPU Cooler Server Processor
View Product Specifications
High Performance Copper LGA4189 400W Copper Base+copper Fins CPU Cooler Water Cooling Block LGA4189 Server Heat Sink
View Product Specifications
Computer Heatsink 120W BGA 2518 CPU Server Cooler Heatsink 120 * 84 * 28.5mm with Backplate
View Product SpecificationsIn the current era of artificial intelligence (AI), machine learning (ML), high-performance computing (HPC), and cloud infrastructure, thermal design has transitioned from a supporting engineering discipline to a critical design metric. Modern processors, such as the Intel® Xeon® Scalable processor family (supporting LGA4677 and LGA4189 sockets) and AMD EPYC™ processors (SP3, SP6, and SP5 platforms), have pushed thermal design profiles (TDP) past the 350W–400W boundary. To avoid thermal throttling, preserve system reliability, and maintain structural integrity, modern hardware requires advanced, industrial-grade server radiators and CPU coolers. As a leading manufacturer and supplier, we engineer solutions that optimize thermal conductivity, airflow aerodynamics, and component MTBF.
Modern server racks require denser component placement than ever before. With 1U, 2U, and 4U chassis configurations housing multiple processors, dense storage configurations, and advanced memory layouts, the physical space allocated to server radiators is severely restricted. Engineers must optimize cooling solutions within strict dimensional limits to prevent airflow resistance and system bottlenecks.
Our research and development team addresses these constraints by designing low-profile radiators, such as 1U and 2U passive and active heat sinks, utilizing high-density copper fins and specialized vapor chambers that maximize heat transfer per cubic millimeter.
When server processors exceed their optimal thermal limits, dynamic frequency scaling reduces clock speeds to lower power output. This thermal throttling reduces compute capability, increases data latency, and negatively impacts server efficiency. Over time, high operating temperatures accelerate component degradation, leading to premature failure of semiconductors, capacitors, and memory modules.
Implementing precision-engineered copper bases, high-performance heat pipes, and robust interface materials ensures that CPUs operate within their nominal temperature ranges, maximizing hardware performance and extending system lifespans.
Originally established and registered between 2015–2018, VoltDRAM Semiconductor Co., Ltd. has developed into a global supplier specializing in high-performance DRAM solutions, high-speed DDR5 memory architectures, and integrated thermal management solutions for modern servers. Recognizing that high-frequency memory modules and high-TDP CPUs operate in the same thermal environment, we have combined semiconductor and thermal engineering to create highly efficient systems.
Operating a production facility of approximately 320–480㎡, VoltDRAM generates an annual export revenue of USD 8–18 million. Supported by 6–9 years of export experience and 8–15 years of industry expertise, our engineering teams design cooling products that meet strict industrial standards.
Our quality assurance processes utilize ISO-based quality management systems, combined with automated optical inspection (AOI), electrical performance testing, burn-in testing, and reliability stress testing to verify physical tolerances and thermal transfer properties. Our QA department includes 35–80 experienced inspectors to ensure every component meets high standards before shipping.
Achieving stable temperatures in server environments requires selecting the correct mechanical structure for the specific application. The table below outlines key engineering metrics for standard configurations.
| Cooler Classification | Socket Compatibility | Max TDP Support | Material Composition | Primary Applications |
|---|---|---|---|---|
| 1U Ultra-Thin Passive Heatsink | LGA115X, LGA1200, LGA1700 | 95W - 110W | Pure Copper C1100 Base & Fins | High-density computing servers, firewall appliances |
| 2U Active Heat Pipe Radiator | LGA3647, LGA4189, AMD SP3 | 205W - 320W | Copper Base, Aluminum Fins, 4-6 Heat Pipes | Standard rack servers, storage arrays, cloud platforms |
| 4U Enterprise High-Power Air Cooler | LGA4926, LGA4677, AMD SP6 | 300W - 350W | Vapor Chamber Base, Composite Heat Pipes | AI workstations, GPU systems, edge compute nodes |
| 1U / 2U Direct-to-Chip Liquid Block | LGA4677, LGA4189 | 400W+ | Oxygen-free Copper Block, Micro-channels | Hyperscale data centers, supercomputing clusters |
A comprehensive framework for procurement managers, hardware engineers, and system integrators to evaluate cooling technologies.
We source raw materials directly from certified suppliers. High-purity copper (C1100, >99.9%) and specialized aluminum alloys are chosen to maintain thermal performance. Every component meets CE, FCC, RoHS, and REACH requirements, ensuring environmental compliance in North American and European markets.
For active cooling configurations, the fan represents a potential point of failure. Our fans feature advanced hydraulic or dual-ball bearing designs. They operate continuously for up to 70,000 hours under thermal stress, maintaining steady airflow with minimal noise level variation.
Server motherboards vary by system integrator. VoltDRAM offers tailored mechanical and thermal engineering, allowing customization of base plate geometry, mounting pressure adjustments, and heat pipe routing to ensure compatibility with surrounding components.
How thermal management architectures are evolving to support next-generation compute workloads.
In-depth explanations of critical thermal engineering concepts and procurement questions.
Explore our complete range of specialized cooling components, designed to fit AMD, Intel, and customized BGA socket architectures.
LGA1700-T67 Refrigeration Chip Server Radiator air Cooler Fins CPU 2U Radiator Copper Heat Pipe
View Product Specifications
Heat sink LGA115X-1U3E 110W square motherboard copper heat sink 1150 1151 1155 1156 1200 server CPU fan heat sink
View Product Specifications
Hot Selling Heat Sink 320W LGA4189-N96 4U 6U Heat Pipe Heat Sink Suitable for Server Processors
View Product Specifications
Factory wholesale radiator 350W AMD SP6 suitable for 2U server cooler CPU fan cooler
View Product Specifications
Server Heatsink 205W LGA3647 2U Aluminum Fin 4 Heat Pipe Computer Aluminum Heatsink CPU Cooler
View Product Specifications
Manufacturer Supplied Server Heatsink SP3 Air-cooled Heatsink CPU Cooler Dual Ball Bearings
View Product Specifications
Processor Heatsink LGA4926 300W Server Heatsink 2U Server CPU Cooler Copper Aluminum Sheet 5 Heat Pipe
View Product Specifications
Hot Selling SP3 1U Server High Power CPU Heat Sink Copper Bottom Refrigeration Pad Cooler Fan CPU Heat Sink
View Product SpecificationsOur cleanrooms, assembly lines, and testing equipment ensure each memory module and thermal management device meets performance specifications before integration.