| Layer count |
1-68L |
64 Layer |
| Max thickness |
10mm (394mil) |
14mm (551mil) |
| Min line width/space (Inner layer) |
2.2mil / 2.2mil |
2.0mil / 2.0mil |
| Min line width/space (Outer layer) |
2.5mil / 2.5mil |
2.2mil / 2.2mil |
| Alignment capability (with the core board) |
±25um |
±20um |
| Inner layer alignment |
±5mil |
±4mil |
| Max copper |
6Oz |
30 oz |
| Holes size (mechanical drilling) |
≥0.15mm (6mil) |
≥0.1mm (4mil) |
| Holes size (laser drilling) |
0.1mm (4mil) |
0.050mm (2mil) |
| Max size (Unit size) |
850mm X 570mm |
1000mm X 600mm |
| Max size (Panel size) |
1250mm X 570mm |
1320mm X 600mm |
| Aspect ratio (Unit size) |
20:1 |
28:1 |
| Aspect ratio (Panel size) |
25:1 |
35:1 |
| Material (lead-free/halogen-free) |
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
| Material (high-speed PCB material) |
Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 |
| Material (high-frequency PCB material) |
Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
| Material (Others) |
Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 |
| Surface finished |
HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold/Soft Gold Plating |
| Special technology |
Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB |